Mentor的热设计解决方案减少了总体设计时间，减少后期设计返工，缩短上市时间，increase reliability,and reduce the final cost of electronics products.Solve most design problems associated with cooling for electronics,包括IC封装和散热器设计，thermal design of printed circuit boards,and selection of cooling fans.
Packaging-Level Design Tasks
As components shrink,模具越薄，模具间温度变化越大，因此，结温不再是一个单一的值。Intra-die effects resulting from die stacking makes hot spot temperature and location dependant on the power distribution on the die,是一个函数，即使用配置文件。Detailed package thermal models and die power maps are needed for the most challenging products designs with active power management.在半导体行业，三维集成电路迫使集成电路设计流程具有温度感知能力。
Component-level Design Tasks
Accurate component temperature prediction is necessary to ensure components operate within safe limits.在整个设计流程中，a component's representation must evolve predict heat flux split between the board and the air or attached heatsink,外壳温度，以及结温，and in extreme cases temperature variation across the die itself.Suppliers are required to provide thermal models to their customers that support their design needs.
PCB-level Design Tasks
印刷电路板的冷却很大程度上取决于局部气流分布，which is disrupted as air passes over the components on the board,leading to maldistribution,recirculations and hot spots on the board,并且由于添加了散热片而加剧。Component placement and the design of the board itself strongly influence component cooling.Cooling can be enhanced by careful attention to the copper content and layout close to the component,并通过使用下面的热通孔组件。
Enclosure-level Design Tasks
Electronics cooling is a challenge that starts at the system-level,尤其适用于空冷电子设备。Air flow through the system cools the electronics,但是被电子和其他内部几何结构破坏了。Changes to either the enclosure or the electronics alters the air flow rate and distribution and consequently the cooling,making adding heatsinks as a design afterthought perilous.Correct sizing and positioning of fans and vents and heatsink sizing and optimization are system-level design tasks.